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Thermal Potting Electronic Adhesive with Shore D 50 to 80 Hardness 1:1 Mix Ratio and Thermal Conductivity 1.0 to 5.0 W/m·K

Thermal Potting Electronic Adhesive with Shore D 50 to 80 Hardness 1:1 Mix Ratio and Thermal Conductivity 1.0 to 5.0 W/m·K

Detail Information
Mix Ratio:
1:1
Dielectric Strength:
12 KV/mm
Color:
Black, Gray, Or Translucent
Thermalconductivity:
1.0 To 5.0 W/m·K
Coefficientofthermalexpansion:
20 To 50 Ppm/°C
Hardness:
Shore D 50 To 80
Model:
Thermal Potting
Type:
Electronic Adhesive
Highlight:

Shore D 50 to 80 Hardness Thermal Potting

,

1:1 Mix Ratio Electronic Adhesive

,

Thermal Conductivity 1.0 to 5.0 W/m·K Potting Compound

Product Description

Product Description:

The Thermal Potting product is a high-performance electronic adhesive designed to provide exceptional protection and insulation for a wide range of electronic components. With a precise mix ratio of 1:1, this product ensures easy and accurate preparation, allowing users to achieve optimal consistency and performance every time. Its superior dielectric strength of 12 KV/mm makes it an ideal choice for applications requiring excellent electrical insulation, ensuring the safety and longevity of sensitive electronic devices.

Available in three versatile colors—black, gray, and translucent—the Thermal Potting product offers flexibility to meet various aesthetic and functional requirements. Whether you need a discreet black finish, a neutral gray tone, or a clear translucent option for visibility, this product can cater to your specific needs. Its hardness ranges from Shore D 50 to 80, providing a durable and resilient protective layer that can withstand mechanical stresses without compromising its insulating properties.

One of the key applications of this Thermal Potting product is in the manufacturing and maintenance of Electric Hot Pot Cookers. These kitchen appliances require reliable insulation and strong adhesion to ensure safe operation under high temperatures and frequent use. The Thermal Potting compound effectively encapsulates internal components, protecting them from moisture, dust, and mechanical damage while maintaining excellent thermal conductivity. This makes it an indispensable material for enhancing the durability and performance of Electric Hot Pot Cookers.

In addition to Electric Hot Pot Cookers, the Thermal Potting product is also well-suited for Ceramic Outdoor Pots used in various heating and cooking devices. The adhesive’s robust dielectric strength and wide hardness range enable it to perform reliably in outdoor environments where exposure to temperature fluctuations, humidity, and mechanical vibrations is common. By using this product, manufacturers can ensure that their Ceramic Outdoor Pots maintain structural integrity and electrical safety, even in demanding conditions.

As an electronic adhesive, the Thermal Potting product is formulated to bond securely with a variety of substrates, including metals, ceramics, and plastics. This versatility makes it an excellent choice for complex assemblies requiring both mechanical support and electrical insulation. Its balanced hardness range allows it to cushion sensitive components while providing a firm protective shell, reducing the risk of damage during handling or operation.

The product’s ease of use, combined with its outstanding technical specifications, makes it a preferred solution for engineers and technicians working on Electric Hot Pot Cookers and similar appliances. Its 1:1 mix ratio simplifies the preparation process, minimizing waste and ensuring consistent quality. Furthermore, the high dielectric strength of 12 KV/mm guarantees that the electrical insulation meets stringent safety standards, reducing the risk of short circuits and electrical failures.

In summary, the Thermal Potting product stands out as a reliable, efficient, and versatile electronic adhesive tailored to meet the demands of modern electronic and heating appliances. Its combination of excellent dielectric strength, customizable color options, and adjustable hardness makes it particularly suitable for applications involving Electric Hot Pot Cookers and Ceramic Outdoor Pots. By choosing this Thermal Potting compound, manufacturers and repair professionals can enhance the safety, durability, and performance of their products, ensuring customer satisfaction and long-term reliability.


Features:

  • Product Name: Thermal Potting
  • High moisture resistance, ideal for use in Glass Cool Kettle and Hot Pot Table applications
  • Model: Thermal Potting
  • Full cure time: 24 hours at 25℃ or 50 to 70 minutes at 80℃
  • Hardness range: Shore D 50 to 80, providing durable and reliable protection
  • Flame retardant rating: UL 94 V-0, ensuring safety in Glass Cool Kettle and other heat-related environments

Technical Parameters:

Product Name Thermal Potting
Type Electronic Adhesive
Coefficient of Thermal Expansion 20 To 50 Ppm/°C
Dielectric Strength 12 KV/mm
Mix Ratio 1:1
Moisture Resistance High
Viscosity 500 To 5000 CP
Color Black, Gray, Or Translucent
Thermal Conductivity 1.0 To 5.0 W/m·K
Hardness Shore D 50 To 80

Applications:

The Thermal Potting product is an advanced electronic adhesive designed for applications requiring high moisture resistance and exceptional flame retardant properties. With a UL 94 V-0 flame retardant rating, this thermal potting compound ensures safety and reliability in various high-temperature and high-risk environments. Its dielectric strength, ranging from 10 to 20 KV/mm, provides excellent electrical insulation, making it ideal for protecting sensitive electronic components from electrical breakdown and enhancing overall device durability.

This versatile product boasts a viscosity range of 500 to 5000 CP, allowing it to be easily applied in different manufacturing processes, from low-viscosity coatings to thicker encapsulations. Its adaptability makes it perfect for use in a variety of electronic devices and appliances, especially those exposed to moisture, heat, and electrical stress.

One of the primary application occasions for this thermal potting adhesive is in the assembly and protection of Glass Cool Kettles. These kettles often contain delicate electronic heating elements and sensors that must be safeguarded against moisture ingress and electrical faults. The high moisture resistance and dielectric strength of this thermal potting compound make it an excellent choice to encapsulate and protect these components, thereby extending the product’s lifespan and performance reliability.

Similarly, the Thermal Potting product is extensively used in Electric Hot Pot Cookers. These appliances operate at high temperatures and involve constant exposure to steam and liquids. The flame retardant property UL 94 V-0 ensures that the adhesive will not contribute to fire hazards, while its robust moisture resistance protects the internal electronics from damage caused by condensation or spills. This makes it a vital material in ensuring user safety and product durability.

Additionally, the product is highly suitable for Ceramic Outdoor Pot applications. Outdoor pots equipped with heating or electronic components require materials that can withstand environmental factors such as humidity, temperature fluctuations, and potential electrical surges. The dielectric strength and moisture resistance of this thermal potting adhesive provide reliable protection for these components, ensuring consistent performance even in challenging outdoor conditions.

In summary, the Thermal Potting electronic adhesive is an indispensable solution for manufacturers and repairers working with Glass Cool Kettles, Electric Hot Pot Cookers, and Ceramic Outdoor Pots. Its high moisture resistance, superior flame retardant rating, excellent dielectric strength, and adaptable viscosity make it a highly effective material for protecting electronic components in a wide range of thermal and moisture-exposed scenarios.