Thermal Potting Compound with 24h Cure Time at 25C, 1.0 to 5.0 W/m·K Thermal Conductivity, and 12 KV/mm Dielectric Strength

Product Description:

Thermal Potting is an advanced material designed to provide exceptional thermal management and protection in various electronic applications. This product stands out due to its impressive dielectric strength of 12 KV/mm, ensuring excellent electrical insulation and safeguarding sensitive components from electrical failures. Its high moisture resistance further enhances durability, making it suitable for use in environments where exposure to humidity or moisture is a concern.

The Thermal Potting material is formulated with a precise mix ratio of 1:1, allowing for easy and consistent application. This balanced combination ensures optimal curing and performance, making it an ideal choice for manufacturers and technicians who require reliable and repeatable potting solutions. One of the key features of this product is its thermal conductivity, which ranges from 1.0 to 5.0 W/m·K. This range provides flexibility in heat dissipation, allowing the material to effectively transfer heat away from critical components and maintain stable operational temperatures.

In practical terms, Thermal Potting is widely used in the production and maintenance of Electric Hot Pot Cookers, where managing heat efficiently is crucial for safety and performance. The material’s ability to withstand high voltages while maintaining superior thermal conductivity makes it an excellent choice for insulating heating elements and electronic circuits within these cookers. Additionally, its moisture resistance protects internal components from steam and water exposure, common in cooking environments.

Moreover, Thermal Potting is compatible with a variety of kitchen appliance designs, including those incorporating Glass Cool Kettles. The material’s thermal properties ensure that the heat generated during operation is effectively managed, preserving the integrity of the glass and preventing overheating. This compatibility highlights the versatility of Thermal Potting, making it suitable for modern appliance designs that emphasize both functionality and aesthetic appeal.

Besides its application in kitchen appliances, Thermal Potting is also relevant in the production of Hot Pot Seasoning Packets packaging machinery and related electronic systems. The robust insulation and thermal management capabilities of the material help maintain the performance and safety of automated equipment used in the packaging process. This ensures that the machinery operates smoothly without overheating or electrical breakdowns, contributing to efficient production lines and high-quality packaging outcomes.

In summary, Thermal Potting is a superior potting compound that combines high dielectric strength, excellent moisture resistance, and customizable thermal conductivity to meet the demanding needs of modern electronic and appliance manufacturing. Its easy 1:1 mix ratio simplifies application, while its performance characteristics ensure reliable protection and thermal management. Whether used in Electric Hot Pot Cookers, Glass Cool Kettles, or equipment related to Hot Pot Seasoning Packets, Thermal Potting delivers outstanding results, enhancing both safety and efficiency in a variety of settings.

Features:

• Product Name: Thermal Potting
• Full Cure Time: 24h @ 25℃ / 50~70min @ 80℃
• Viscosity Range: 500 to 5000 CP
• High Moisture Resistance
• Mix Ratio: 1:1
• Ideal for use with Hot Pot Seasoning Packets and Ceramic Outdoor Pot applications
• Ensures durability and protection in environments involving Hot Pot Seasoning Packets

Technical Parameters:

Applications:

Thermal potting materials with thermal conductivity ranging from 1.0 to 5.0 W/m·K are essential for a variety of industrial and consumer applications where efficient heat dissipation is critical. These products, characterized by viscosities between 500 to 5000 CP, provide excellent thermal interface solutions that ensure optimal performance and longevity of electrical and electronic components. Their coefficient of thermal expansion, ranging from 20 to 50 Ppm/°C, allows for effective accommodation of material expansion and contraction during thermal cycling, minimizing stress and potential damage.

One common application of thermal potting is in Ceramic Outdoor Pots, which require reliable thermal management to maintain temperature stability during various environmental conditions. The high moisture resistance of the thermal potting compound protects sensitive internal components from humidity and water ingress, making it ideal for outdoor use. By potting the internal electronics with this thermal compound, manufacturers can ensure that the Ceramic Outdoor Pot performs efficiently even in harsh weather conditions, preventing overheating and enhancing product durability.

Another significant application is in Electric Hot Pot Cookers, where thermal potting materials play a crucial role in heat transfer and electrical insulation. The thermal potting compound's ability to cure fully within 24 hours at 25℃ or accelerate curing to 50~70 minutes at 80℃ allows manufacturers to optimize production timelines without compromising on quality. In Electric Hot Pot Cookers, the thermal potting ensures that heating elements and electronic circuits remain securely encapsulated, providing excellent thermal conduction while safeguarding against moisture and mechanical vibrations during cooking.

Furthermore, thermal potting compounds are integral to the manufacturing and operation of Heat Staking Machines. These machines rely on precise heat control to bond plastic components, and the thermal potting helps manage heat flow efficiently while protecting sensitive electronic parts from thermal damage. The high viscosity range of the potting material ensures it fills intricate cavities and voids within the Heat Staking Machine, providing robust mechanical support and thermal stability. Its high moisture resistance also guarantees long-term reliability even in environments with fluctuating temperature and humidity levels.

Overall, the thermal potting product is versatile and well-suited for applications that demand superior thermal conductivity, mechanical resilience, and environmental protection. Its tailored properties make it an indispensable solution in industries involving Ceramic Outdoor Pots, Electric Hot Pot Cookers, and Heat Staking Machines, ensuring enhanced performance, safety, and lifespan of these devices.