Thermal Potting Electronic Adhesive with 1:1 Mix Ratio, Thermal Conductivity 1.0 To 5.0 W/m·K, and Shore D 50 To 80 Hardness

Product Description:

The Thermal Potting product is an advanced electronic adhesive designed specifically to meet the rigorous demands of modern electronic applications. With its exceptional dielectric strength ranging from 10 to 20 KV/mm, this product ensures superior insulation and protection, making it ideal for use in high-voltage environments. The dielectric strength of 12 KV/mm guarantees reliable performance and safety, effectively preventing electrical breakdowns and enhancing the longevity of electronic components.

This Thermal Potting adhesive features a precise mix ratio of 1:1, allowing for easy and accurate preparation. The balanced formulation ensures consistent properties throughout the curing process, resulting in a uniform and robust potting compound. This quality is critical for applications requiring dependable insulation and mechanical stability, such as in the manufacturing of Ceramic Outdoor Pot devices and other electronic assemblies exposed to harsh environmental conditions.

The product's full cure time is optimized to provide both efficiency and reliability. At room temperature (25℃), the adhesive fully cures within 24 hours, making it suitable for applications where gradual curing is acceptable. For faster processing, the cure time can be significantly reduced to 50 to 70 minutes when cured at an elevated temperature of 80℃. This flexibility in curing conditions allows manufacturers to tailor the production process according to specific needs, whether for rapid prototyping or large-scale production runs.

One of the key applications of this Thermal Potting product is in the production of Ceramic Outdoor Pot components. Ceramic Outdoor Pot units often require materials that can withstand extreme weather conditions, high voltage, and mechanical stress. This electronic adhesive’s excellent dielectric properties and strong adhesion capabilities ensure that the Ceramic Outdoor Pot maintains its integrity and functionality over extended periods, even when exposed to moisture, temperature fluctuations, and electrical stress.

In addition, this Thermal Potting adhesive is highly suitable for integration in Hot Pot Table electronics. Hot Pot Tables often incorporate heating elements and electronic controls that demand effective insulation to prevent short circuits and ensure user safety. The product’s superior dielectric strength and robust curing characteristics provide an ideal solution for potting and encapsulating these sensitive electronic parts, enhancing both performance and durability.

Moreover, the Thermal Potting product offers excellent resistance to thermal cycling and environmental factors, making it a versatile choice for various outdoor and indoor electronic applications. Its strong bonding capabilities help to secure components firmly in place, preventing movement or damage caused by vibration or mechanical shock. This makes it a preferred choice for manufacturers looking to improve the reliability of their electronic assemblies without compromising on safety or quality.

In summary, the Thermal Potting product stands out as a reliable, high-performance electronic adhesive tailored for demanding applications involving Ceramic Outdoor Pot and Hot Pot Table technologies. With its impressive dielectric strength of 12 KV/mm, easy 1:1 mixing ratio, and adaptable curing times, it offers a perfect balance between efficiency and quality. Whether you are producing outdoor ceramic pots requiring robust insulation or sophisticated hot pot tables that need secure electronic encapsulation, this thermal potting adhesive provides the essential properties to meet and exceed industry standards.

Choosing this Thermal Potting product means investing in a solution that enhances electrical insulation, ensures mechanical stability, and withstands environmental challenges. Its proven performance in applications such as Ceramic Outdoor Pot and Hot Pot Table electronics underscores its value as a critical material in modern electronic manufacturing. With its comprehensive attributes, this product is poised to deliver long-term reliability and safety for your electronic potting needs.

Features:

• Product Name: Thermal Potting
• Full Cure Time: 24h @ 25℃ / 50~70min @ 80℃
• Dielectric Strength: 10 to 20 KV/mm
• Coefficient of Thermal Expansion: 20 to 50 Ppm/°C
• Moisture Resistance: High
• Hardness: Shore D 50 to 80
• Compatible with Heat Staking Machine applications
• Ideal for use in Ceramic Outdoor Pot environments
• Provides excellent protection for Ceramic Outdoor Pot components

Technical Parameters:

Applications:

The Thermal Potting product is specially designed for use in Electric Hot Pot Cookers, providing exceptional protection and durability to internal electronic components. Its high dielectric strength of 12 KV/mm ensures outstanding electrical insulation, making it ideal for applications where electrical safety and reliability are paramount. This makes the Thermal Potting an excellent choice for manufacturers of Electric Hot Pot Cookers aiming to enhance the longevity and safety of their devices.

One of the critical application occasions for this Thermal Potting is in the assembly and production of Electric Hot Pot Cookers, where moisture resistance is essential due to the frequent exposure to steam and water during cooking. The product’s high moisture resistance protects sensitive electronic parts from humidity and potential corrosion, ensuring stable operation even in harsh kitchen environments. This feature also makes it suitable for use with Hot Pot Seasoning Packets packaging machinery, where moisture and temperature fluctuations are common.

The Thermal Potting material exhibits a coefficient of thermal expansion ranging from 20 to 50 Ppm/°C, allowing it to accommodate the thermal stresses encountered during heating and cooling cycles typical of Electric Hot Pot Cookers. This minimizes the risk of cracks and component displacement, enhancing the durability and reliability of the device. Its hardness, measured between Shore D 50 to 80, provides a balanced mechanical strength that protects internal parts from vibration and mechanical shocks without compromising flexibility.

Furthermore, the Thermal Potting’s full cure time is optimized for industrial production lines, with a curing period of 24 hours at 25℃ or a rapid cure of 50 to 70 minutes at 80℃. This flexibility allows manufacturers to choose curing conditions that best fit their production schedules, ensuring efficient assembly without sacrificing product integrity.

In summary, the Thermal Potting product is perfectly suited for applications in Electric Hot Pot Cookers and related devices, including those handling Hot Pot Seasoning Packets. Its superior electrical insulation, moisture resistance, thermal expansion compatibility, mechanical hardness, and adaptable curing times make it a reliable solution for enhancing the performance and safety of electric cooking appliances.