Thermal Potting Electronic Adhesive with Shore D 50 to 80 Hardness and Thermal Conductivity 1.0 to 5.0 W/m·K for Optimal Heat Transfer

Product Description:

The Thermal Potting is an advanced material designed specifically to meet the rigorous demands of modern thermal management applications. With a thermal conductivity ranging from 1.0 to 5.0 W/m·K, this product ensures efficient heat dissipation, making it an ideal choice for industries and devices where effective thermal regulation is crucial. Whether you are working with a Heat Staking Machine, an Electric Hot Pot Cooker, or even a Glass Cool Kettle, the Thermal Potting provides exceptional performance in maintaining optimum operating temperatures and safeguarding sensitive components.

One of the standout features of the Thermal Potting is its coefficient of thermal expansion, which ranges between 20 to 50 ppm/°C. This attribute allows the material to expand and contract in harmony with the surrounding components, minimizing the risk of cracking or delamination during thermal cycling. This property is especially critical in applications involving repetitive heating and cooling cycles, such as in Electric Hot Pot Cookers, where consistent thermal stability is essential for long-term durability and safety.

In terms of curing, the Thermal Potting offers flexibility to suit different production schedules and requirements. The full cure time is 24 hours at 25℃, ensuring thorough hardening and optimal mechanical and thermal properties under standard conditions. For faster production needs, the cure time can be reduced to just 50 to 70 minutes when curing at an elevated temperature of 80℃. This dual curing option enables manufacturers to balance between quality and efficiency, making the Thermal Potting a versatile solution for both small-scale and mass production environments.

Moisture resistance is another critical characteristic of the Thermal Potting, which exhibits high resistance to moisture ingress. This attribute protects electronic and mechanical components from damage caused by humidity, corrosion, and electrical shorts. For devices like Glass Cool Kettles, which often operate in environments with varying humidity levels, this moisture resistance ensures reliability and longevity. Similarly, in Heat Staking Machines, which may be exposed to various environmental conditions, the Thermal Potting’s moisture resistance helps maintain performance integrity and reduces maintenance needs.

The Thermal Potting model is engineered to provide excellent adhesion and compatibility with a wide range of substrates, including metals, ceramics, and plastics. This makes it a preferred choice for potting applications where a robust bond is necessary to secure components and fill voids, preventing movement and vibration damage. Its high thermal conductivity combined with mechanical robustness makes it suitable for potting critical components in devices like Electric Hot Pot Cookers, where both heat transfer and protection are paramount.

In summary, the Thermal Potting product is a highly effective thermal management solution designed to meet the needs of industries requiring reliable heat dissipation, mechanical stability, and environmental protection. Its thermal conductivity of 1.0 to 5.0 W/m·K, combined with a coefficient of thermal expansion between 20 and 50 ppm/°C, ensures excellent performance during thermal cycling. The flexible curing times enhance manufacturing efficiency, while its high moisture resistance guarantees long-term durability. Whether applied in Heat Staking Machines, Electric Hot Pot Cookers, or Glass Cool Kettles, the Thermal Potting model delivers superior thermal and protective properties, making it an indispensable material for modern thermal potting applications.

Features:

• Product Name: Thermal Potting
• Full Cure Time: 24h @ 25℃ / 50~70min @ 80℃
• Available Colors: Black, Gray, or Translucent
• Flame Retardant Rating: UL 94 V-0
• Dielectric Strength: 10 to 20 KV/mm
• Ideal for use in Glass Cool Kettle applications
• Perfect for Electric Hot Pot Cooker insulation
• Suitable for Ceramic Outdoor Pot manufacturing

Technical Parameters:

Applications:

The Thermal Potting product is an essential solution designed for advanced thermal management and electrical insulation in various industrial and commercial applications. With a viscosity range of 500 to 5000 CP, this product offers excellent adaptability to different potting requirements, ensuring a smooth and efficient application process. Its high dielectric strength of 12 KV/mm guarantees superior electrical insulation, making it ideal for protecting sensitive electronic components from electrical interference and potential damage.

One of the primary application occasions for the Thermal Potting product is in the manufacturing and maintenance of kitchen appliances such as Glass Cool Kettles and Ceramic Outdoor Pots. These appliances often require effective thermal management to maintain temperature stability and ensure user safety. The Thermal Potting material's coefficient of thermal expansion, ranging from 20 to 50 Ppm/°C, closely matches that of glass and ceramic materials, preventing cracking or deformation due to temperature changes. This characteristic makes it highly suitable for potting components within Glass Cool Kettles and Ceramic Outdoor Pots, where thermal cycling is common.

In addition to household appliances, the Thermal Potting product is widely used in the food industry, particularly in the packaging and handling of Hot Pot Seasoning Packets. These packets often contain heat-sensitive components that require reliable insulation and thermal protection during processing and shipping. The Thermal Potting material ensures these seasoning packets maintain their integrity by providing a stable thermal barrier, preventing overheating or spoilage.

Moreover, the Thermal Potting product is ideal for electronic device manufacturing and repair, where thermal management is critical to device longevity and performance. Its excellent dielectric strength protects electronic circuits from voltage surges and electrical faults, while its adaptable viscosity allows it to fill intricate spaces and encapsulate components effectively.

Overall, the Thermal Potting product is highly versatile, serving applications that demand reliable thermal management and electrical insulation. Whether it is used in Glass Cool Kettles, Ceramic Outdoor Pots, or protecting Hot Pot Seasoning Packets, this product delivers outstanding performance, durability, and safety across diverse scenarios.