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Thermal Potting Electronic Adhesive with Shore D 50 To 80 Hardness UL 94 V-0 Flame Retardant and 1:1 Mix Ratio for Industrial Applications

Thermal Potting Electronic Adhesive with Shore D 50 To 80 Hardness UL 94 V-0 Flame Retardant and 1:1 Mix Ratio for Industrial Applications

Detail Information
Mix Ratio:
1:1
Coefficientofthermalexpansion:
20 To 50 Ppm/°C
Moistureresistance:
High
Type:
Electronic Adhesive
Thermalconductivity:
1.0 To 5.0 W/m·K
Dielectricstrength:
10 To 20 KV/mm
Viscosity:
500 To 5000 CP
Full Cure Time:
24h @ 25℃ / 50~70min @ 80℃
Highlight:

Shore D 50 To 80 Hardness Thermal Potting

,

UL 94 V-0 Flame Retardant Electronic Adhesive

,

1:1 Mix Ratio Potting Compound

Product Description

Product Description:

The Thermal Potting product is an advanced material designed to provide exceptional thermal management and electrical insulation for a variety of applications. Engineered with high-performance properties, this potting compound ensures reliability and durability in demanding environments. One of the standout features of this thermal potting product is its excellent flame retardant capability, certified to meet the stringent UL 94 V-0 standard. This rating guarantees that the material self-extinguishes quickly after exposure to flame, making it a safe choice for electronic and electrical components that require enhanced fire protection.

In addition to its safety characteristics, the Thermal Potting product boasts a full cure time of 24 hours at 25℃, allowing for thorough cross-linking and optimal mechanical properties. For faster processing, it can also cure within 50 to 70 minutes at an elevated temperature of 80℃, providing flexibility for different manufacturing workflows. This dual curing capability ensures that the product can be adapted to various production schedules without compromising its performance.

Thermally, the product exhibits a coefficient of thermal expansion ranging from 20 to 50 ppm/°C. This range is carefully balanced to accommodate thermal stresses and minimize dimensional changes in applications that experience temperature fluctuations. Such stability is crucial in maintaining the integrity of components like Ceramic Outdoor Pot assemblies and Glass Cool Kettles, where thermal cycling is common.

Dielectric strength is another critical attribute of this Thermal Potting product, with a robust rating of 12 KV/mm. This high dielectric strength ensures excellent electrical insulation, protecting sensitive components from voltage breakdown and electrical interference. It is particularly beneficial when used in electronic housings or encapsulations such as Ceramic Outdoor Pot designs, where maintaining electrical isolation is essential for functionality and safety.

The product is available in three color options: black, gray, and translucent. This variety allows for aesthetic customization and functional differentiation depending on the application requirements. For example, the black or gray variants might be preferred for outdoor or industrial uses due to their ability to mask dirt and wear, while the translucent option can be useful for visual inspections or in situations where light transmission is necessary, such as certain Glass Cool Kettle components.

Overall, the Thermal Potting product is a highly versatile and reliable solution for potting and encapsulating electronic and electrical components. Its combination of flame retardant properties, flexible curing times, controlled thermal expansion, and superior dielectric strength makes it an ideal choice for applications involving Ceramic Outdoor Pot and Glass Cool Kettle products. Whether protecting delicate circuitry or enhancing the durability of outdoor ceramic cookware, this potting compound delivers outstanding performance and safety.

In summary, the Thermal Potting product offers a comprehensive set of features tailored to meet the needs of modern electronic packaging and thermal management. Its UL 94 V-0 flame retardancy, efficient curing options, controlled coefficient of thermal expansion, high dielectric strength, and versatile color options position it as a premium material for industries requiring robust and reliable potting solutions. Whether used in the manufacturing of Ceramic Outdoor Pot or integrated within Glass Cool Kettle assemblies, this thermal potting compound ensures longevity, safety, and optimal performance under various operational conditions.


Features:

  • Product Name: Thermal Potting
  • Type: Electronic Adhesive
  • Thermal Conductivity Range: 1.0 to 5.0 W/m·K
  • Model: Thermal Potting
  • Mix Ratio: 1:1
  • Dielectric Strength: 12 KV/mm
  • Ideal for use in Glass Cool Kettle applications
  • Perfect adhesive solution for Electric Hot Pot Cooker assembly
  • Suitable for Ceramic Outdoor Pot bonding and insulation

Technical Parameters:

Model Thermal Potting
Hardness Shore D 50 To 80
Viscosity 500 To 5000 CP
Thermal Conductivity 1.0 To 5.0 W/m·K
Full Cure Time 24h @ 25℃ / 50~70min @ 80℃
Dielectric Strength 10 To 20 KV/mm
Coefficient of Thermal Expansion 20 To 50 Ppm/°C
Color Black, Gray, Or Translucent
Dielectric Strength (Additional) 12 KV/mm
Flame Retardant UL 94 V-0

Applications:

The Thermal Potting product is an advanced electronic adhesive specifically designed to meet the demanding needs of modern electronic and electrical appliances. With a viscosity range of 500 to 5000 CP, it offers excellent flow characteristics that ensure complete encapsulation and protection of sensitive components. This makes it an ideal choice for applications requiring precise and reliable insulation, such as in Glass Cool Kettle manufacturing, where maintaining electrical safety and thermal efficiency is paramount.

One of the key application occasions for this Thermal Potting adhesive is in the assembly and protection of electronic circuits within Electric Hot Pot Cookers. The product’s dielectric strength, ranging from 10 to 20 KV/mm, provides superior electrical insulation, preventing short circuits and enhancing device safety. Its UL 94 V-0 flame retardant rating further ensures that the adhesive will not contribute to fire hazards, which is crucial for kitchen appliances like Electric Hot Pot Cookers where high temperatures are regularly encountered.

Another typical scenario for using this product is in the production of Glass Cool Kettles. These appliances require excellent thermal management and electrical insulation to safely operate at high temperatures while ensuring user safety. The Thermal Potting adhesive’s mix ratio of 1:1 simplifies the preparation process, allowing manufacturers to achieve consistent performance and optimal curing. Its flame retardant properties add an additional layer of safety, making it a trusted solution for enhancing the reliability and durability of Glass Cool Kettle components.

Beyond household appliances, the Thermal Potting electronic adhesive is also suitable for use in various industrial and consumer electronics where protection against moisture, dust, and mechanical stress is necessary. By providing robust encapsulation, it helps prolong the lifespan of electronic modules and maintains their performance under harsh operating conditions. Whether it’s in the context of an Electric Hot Pot Cooker or a Glass Cool Kettle, this adhesive ensures that the internal electronics remain secure, stable, and efficient throughout the product’s lifecycle.

In summary, the Thermal Potting product is perfectly suited for application occasions and scenarios that demand high dielectric strength, flame retardancy, and excellent viscosity control. It finds extensive use in the manufacturing and maintenance of Glass Cool Kettle and Electric Hot Pot Cooker appliances, ensuring both safety and functionality in these widely used kitchen devices.