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DongGuan Ancham New Material Technologies Co.,Ltd.
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UL94V0 Electronic Silicone Potting Compound Aging Resistant Thermal Conductive Glue

UL94V0 Electronic Silicone Potting Compound Aging Resistant Thermal Conductive Glue

Brand Name: Ancham
Model Number: AS42(16)
MOQ: 100kg
Price: NA
Payment Terms: T/T
Supply Ability: 50000kg/month
Detail Information
Place of Origin:
China
Certification:
UL94-V0 RoHS REACH
Mix Ratio:
1:1
Thermal Conductivity:
1.6±0.1 W/m-K
Hardness:
65±10 Shore 00
Dielectric Strength:
12 KV/mm
Type:
Electronic Adhesive
Country Of Origin:
China
Packaging Details:
25kg
Supply Ability:
50000kg/month
Highlight:

UL94 V0 Potting Compound

,

Silicone Potting Compound

,

aging resistant thermal conductive glue

Product Description
25KG Gray Electronic Thermal Conductive Silicone Potting Compound With UL94-V0
 
FEATURES
1. Thermal conductivity 1.6W/m·K.
2. Low viscosity, excellent flowability.
3. Good resistance to environmental aging, high and low temperature.
4. Flame retardancy in accordance with UL94-V0.
5. Halogen free, RoHS, REACH compliant.
 
APPLICATIONS
1. Power modules, power supply modules, power batteries, automotive electronics, sensors, communication control equipment potting applications.
2.Sealing protection for heat-generating semiconductors or magnetic components with heat dissipation needs. 
 
TECHNICAL DATA
TYPICAL PROPERTIES AS42 (16)
Mixing Ratio @ 25℃ 1:1
Appearance Gray
Viscosity @ 25℃ 3000±1000 mPa.s
Specific Gravity @ 25℃ 2.35±0.1 g/cm^3
Cure Schedule @ 2cm Initial cure 4~6h @ 25℃
Full cure 24~48h @ 25℃
Full cure 30min @ 80℃
Hardness 65±10 Shore 00
Thermal Conductivity 1.6±0.1 W/m·K
Useful Temperature Ranges -50~200℃
Dielectric Strength 12 kV/mm
Volume Resistivity 7.1x10^13 Ω.cm
Shelf Life (8~28℃)

6 months

 

Product Overview
This two-component silicone potting compound is designed for thermal conductivity and complies with UL94-V0 flammability standards. It can be cured at either room temperature or elevated temperatures, forming an elastic, thermally conductive insulating gel.

Key Features

  • Curing Flexibility: Can be cured at room temperature or high temperature, allowing for versatile application methods.
  • Elastic Insulating Gel: Cures into a flexible gel that provides effective thermal conductivity and insulation.

Performance Characteristics

  • Low Viscosity: The compound features low viscosity, ensuring excellent flowability, which is ideal for filling small gaps in electronic assemblies.
  • Temperature Range: Maintains stable performance across a wide temperature range of -40 to 200℃, demonstrating resilience against extreme thermal conditions.

Durability

  • Impact Resistance: The compound is designed to withstand both high and low temperature impacts without detaching from the shell, ensuring long-lasting protection for electronic components.
FAQ
1. who are we?
We are based in Guangdong, China, start from 2002,sell to Domestic Market(82.00%),Southeast Asia(10.00%),North
America(4.00%),South America(1.20%),Eastern Europe(1.00%),Mid East(0.80%),Western Europe(0.50%),Southern Europe(0.50%). There are
total about 51-100 people in our office.
2. how can we guarantee quality?
Always a pre-production sample before mass production;
Always final Inspection before shipment;
3.what can you buy from us?
Epoxy/Polyurethane/Acrylic Adhesive,Silicone Sealant,Potting Compound,Thermally Conductive adhesive,Conformal Coating